Advances in CMP polishing Technologies for the Manufacture of Electronic Devices

Advances in CMP polishing Technologies for the Manufacture of Electronic Devices
Author: Toshiro Doi,Ioan D. Marinescu,Syuhei Kurokawa
Publsiher: William Andrew
Total Pages: 317
Release: 2011-12
Genre: Science
ISBN: 9781437778595

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CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan

Advances in Chemical Mechanical Planarization CMP

Advances in Chemical Mechanical Planarization  CMP
Author: Suryadevara Babu
Publsiher: Woodhead Publishing
Total Pages: 648
Release: 2021-09-24
Genre: Technology & Engineering
ISBN: 9780128218198

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Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. Reviews the most relevant techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for current and emerging materials Addresses consumables and process control for improved CMP, including post-CMP

Chemical Mechanical Planarization of Semiconductor Materials

Chemical Mechanical Planarization of Semiconductor Materials
Author: M.R. Oliver
Publsiher: Springer Science & Business Media
Total Pages: 428
Release: 2004-01-26
Genre: Technology & Engineering
ISBN: 3540431810

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This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Handbook of Lapping and Polishing

Handbook of Lapping and Polishing
Author: Ioan D. Marinescu,Eckart Uhlmann,Toshiro Doi
Publsiher: CRC Press
Total Pages: 512
Release: 2006-11-20
Genre: Technology & Engineering
ISBN: 9781420017632

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Lapping and polishing are currently the most precise surface finishing processes for mechanical and electronic components. Unfortunately, most improvements in either methods or understanding of the physical processes involved are closely guarded as proprietary information. The Handbook of Lapping and Polishing is the first source in English to bring to the light of day the physical fundamentals and advanced technologies at the leading edge of modern lapping and polishing practice. Collecting decisive work contributed by industrial and academic experts from the USA, Germany, and Japan, this authoritative resource presents the latest lapping and polishing technologies along with case studies that illustrate their value. After a brief introduction, the book explains the fundamental concepts and major types of lapping and polishing processes. The discussion then turns to lapping of ductile and brittle materials followed by an in-depth look at lapping machines and equipment. Rounding out the presentation, the final chapters discuss polishing technologies and equipment as well as the latest on chemical-mechanical polishing (CMP) and its applications in the semiconductor industry. Offering an integrated approach to both theory and practical applications under a single cover, the Handbook of Lapping and Polishing supplies a definitive survey of the most advanced surface finishing technologies available.

Advances in Abrasive Based Machining and Finishing Processes

Advances in Abrasive Based Machining and Finishing Processes
Author: S. Das,G. Kibria,B. Doloi,B. Bhattacharyya
Publsiher: Springer Nature
Total Pages: 271
Release: 2020-05-10
Genre: Technology & Engineering
ISBN: 9783030433123

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This book presents the advances in abrasive based machining and finishing in broad sense. Specifically, the book covers the novel machining and finishing strategies implemented in various advanced machining processes for improving machining accuracy and overall quality of the product. This book presents the capability of advanced machining processes using abrasive grain. It also covers ways for enhancing the production rate as well as quality. It fulfills the gap between the production of any complicated components and successful machining with abrasive particles.

Abrasive Technology

Abrasive Technology
Author: Anna Rudawska
Publsiher: BoD – Books on Demand
Total Pages: 212
Release: 2018-10-24
Genre: Technology & Engineering
ISBN: 9781789841930

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The subject matter of this book is the information on the abrasive technology methods, the characteristics of the methods (for example, the technological parameters, tools, and machines), innovative methods, characteristics of surface structure and surface properties after this type of mechanical process, and application in various industrial branches and other technical and technological domains. Abrasive technology is very important, for example, in precision component manufacturing and nano-technology devices. The aim of this book is to present information on the characteristics and applications of abrasive technology, abrasive tools, tests, and also the innovative methods of this technology. This information enables scientists, engineers, and designers to ensure the soundness and integrity of the fabricated components and to develop new techniques effectively.

Chemical Mechanical Polishing CMP a Key Enabling Technology for Advanced Device Processing

Chemical Mechanical Polishing  CMP    a Key Enabling Technology for Advanced Device Processing
Author: SEMICON Europa,Semiconductor Equipment and Materials International
Publsiher: Unknown
Total Pages: 80
Release: 1998
Genre: Electronic Book
ISBN: OCLC:246044951

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Chemical Mechanical Planarization of Microelectronic Materials

Chemical Mechanical Planarization of Microelectronic Materials
Author: Joseph M. Steigerwald,Shyam P. Murarka,Ronald J. Gutmann
Publsiher: John Wiley & Sons
Total Pages: 337
Release: 2008-09-26
Genre: Science
ISBN: 9783527617753

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Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including: * The history of CMP * Chemical and mechanical underpinnings of CMP * CMP materials and processes * Applications of CMP in the microelectronics industry * The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication * Post-CMP cleaning techniques * Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP.

Wafer Manufacturing Shaping of Single Crystal Silicon Wafers

Wafer Manufacturing  Shaping of Single Crystal Silicon Wafers
Author: Imin Cao,Milind Bhagavat
Publsiher: John Wiley & Sons
Total Pages: 375
Release: 2021-03-22
Genre: Technology & Engineering
ISBN: 9780470061213

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Presenting all the major stages in wafer manufacturing, from crystals to prime wafers. This book first outlines the physics, associated metrology, process modelling and quality requirements and the goes on to discuss wafer forming and wafer surface preparation techniques. The whole is rounded off with a chapter on the research and future challenges in wafer manufacturing.

Handbook of Lapping and Polishing

Handbook of Lapping and Polishing
Author: Ioan D. Marinescu,Eckart Uhlmann,Toshiro Doi
Publsiher: CRC Press
Total Pages: 512
Release: 2006-11-20
Genre: Technology & Engineering
ISBN: 1574446703

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Lapping and polishing are currently the most precise surface finishing processes for mechanical and electronic components. Unfortunately, most improvements in either methods or understanding of the physical processes involved are closely guarded as proprietary information. The Handbook of Lapping and Polishing is the first source in English to bring to the light of day the physical fundamentals and advanced technologies at the leading edge of modern lapping and polishing practice. Collecting decisive work contributed by industrial and academic experts from the USA, Germany, and Japan, this authoritative resource presents the latest lapping and polishing technologies along with case studies that illustrate their value. After a brief introduction, the book explains the fundamental concepts and major types of lapping and polishing processes. The discussion then turns to lapping of ductile and brittle materials followed by an in-depth look at lapping machines and equipment. Rounding out the presentation, the final chapters discuss polishing technologies and equipment as well as the latest on chemical-mechanical polishing (CMP) and its applications in the semiconductor industry. Offering an integrated approach to both theory and practical applications under a single cover, the Handbook of Lapping and Polishing supplies a definitive survey of the most advanced surface finishing technologies available.

Chemical Mechanical Polishing 14

Chemical Mechanical Polishing 14
Author: R. Rhoades,G. Banerjee,B. Basim,L. Economikos,D. Huang,Y. Obeng
Publsiher: The Electrochemical Society
Total Pages: 85
Release: 2016-09-21
Genre: Science
ISBN: 9781607687450

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Advanced Tribology

Advanced Tribology
Author: Jianbin Luo,Yonggang Meng,Tianmin Shao,Qian Zhao
Publsiher: Springer Science & Business Media
Total Pages: 1056
Release: 2010-07-16
Genre: Technology & Engineering
ISBN: 9783642036538

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"Advanced Tribology" is the proceedings of the 5th China International Symposium on Tribology (held every four years) and the 1st International Tribology Symposium of IFToMM, held in Beijing 24th-27th September 2008. It contains seven parts: lubrication; friction and wear; micro/nano-tribology; tribology of coatings, surface and interface; biotribology; tribo-chemistry; industry tribology. The book reflects the recent progress in the fields such as lubrication, friction and wear, coatings, and precision manufacture etc. in the world. The book is intended for researchers, engineers and graduate students in the field of tribology, lubrication, mechanical production and industrial design. The editors Jianbin Luo, Yonggang Meng, Tianmin Shao and Qian Zhao are all the professors at the State Key Lab of Tribology, Tsinghua University, Beijing.

Tribosystem Analysis

Tribosystem Analysis
Author: Peter J. Blau
Publsiher: CRC Press
Total Pages: 192
Release: 2017-12-19
Genre: Technology & Engineering
ISBN: 9781498700511

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Tribosystem Analysis: A Practical Approach to the Diagnosis of Wear Problems provides a systematic framework for conducting root cause analyses and categorizing various types of wear. Designed specifically for engineers without formal training in tribology, this book: Describes a number of direct and indirect methods for detecting and quantifying wear problems Surveys different microscopy techniques, including those for light optics, electron optics, and acoustic imaging Discusses the selection of wear and friction test methods, both standard and custom, identifying possible pitfalls for misuse Presents practical examples involving complex materials and environments, such as those with variable loads and operating conditions Uses universally accepted terminology to create consistency along with the potential to recognize similar problems and apply comparable solutions Complete with checklists to ensure the right questions are asked during diagnosis, Tribosystem Analysis: A Practical Approach to the Diagnosis of Wear Problems offers pragmatic guidance for defining wear problems in the context of the materials and their surroundings.

Introduction to Semiconductor Manufacturing Technology

Introduction to Semiconductor Manufacturing Technology
Author: Hong Xiao
Publsiher: Unknown
Total Pages: 647
Release: 2001
Genre: House & Home
ISBN: 0130224049

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For courses in Semiconductor Manufacturing Technology, IC Fabrication Technology, and Devices: Conventional Flow. This up-to-date text on semiconductor manufacturing processes takes into consideration the rapid development of the industry's technology. It thoroughly describes the complicated and new IC chip fabrication processes in detail with minimum mathematics, physics, and chemistry. Advanced technologies are covered along with older ones to assist students in understanding the development processes from a historic point of view.

Tribocorrosion of Passive Metals and Coatings

Tribocorrosion of Passive Metals and Coatings
Author: D Landolt,S Mischler
Publsiher: Elsevier
Total Pages: 576
Release: 2011-10-12
Genre: Technology & Engineering
ISBN: 9780857093738

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Tribocorrosion causes the degradation or alteration of materials through the combined action of corrosion and wear. It limits the performance and life-time of installations, machines and devices with moving parts, and controls certain manufacturing processes such as chemical–mechanical polishing. The effects of tribocorrosion are most pronounced on passive metals which owe their corrosion resistance to a thin protecting oxide film. Most corrosion-resistant engineering alloys belong to this category. This book provides an introduction to the developing field of tribocorrosion and an overview of the latest research. Part one reviews basic notions of corrosion and tribology, before presenting the most recent results on the growth and structure of passive oxide films. Tribocorrosion mechanisms under fretting, sliding and erosion conditions, respectively, are then discussed. Part two focuses on methods for measuring and preventing tribocorrosion. It includes chapters on electrochemical techniques, the design of tribocorrosion test equipment, data evaluation and the optimisation of materials’ properties for tribocorrosion systems. Part three presents a selection of tribocorrosion problems in engineering and medicine. Three chapters address the tribocorrosion of medical implants including test methods and clinical implications. Other chapters examine tribocorrosion issues in nuclear power plants, marine environments, automotive cooling circuits, elevated-temperature metal working and chemical–mechanical polishing. With its distinguished editors and international team of expert contributors Tribocorrosion of passive metals and coatings is an invaluable reference tool for engineers and researchers in industry and academia confronted with tribocorrosion problems. Comprehensively reviews current research on the tribocorrosion of passive metals and coatings, with particular reference to the design of tribocorrosion test equipment, data evaluation and the optimisation of materials’ properties for tribocorrosion systems Chapters discuss tribocorrosion mechanisms under fretting, sliding and erosion conditions before focussing on methods for measuring and preventing tribocorrosion Includes a comprehensive selection of tribocorrosion problems in engineering and medicine, such as the tribocorrosion of medical implants, and tribocorrosion issues in nuclear power plants, marine environments, automotive cooling circuits and elevated-temperature metal working