Computational heat and mass transfer CHMT 2001 Vol I

Computational heat and mass transfer     CHMT 2001  Vol  I
Author: JOSÉ PONTES
Publsiher: Editora E-papers
Total Pages: 410
Release: 2022
Genre: Electronic Book
ISBN: 9788587922441

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Apresenta tendências, novas idéias e descobertas recentes no campo da Transferência Computacional de Calor e Massa

Computational heat and mass transfer CHMT 2001 Vol II

Computational heat and mass transfer     CHMT 2001  Vol II
Author: JOSÉ PONTES
Publsiher: Editora E-papers
Total Pages: 390
Release: 2022
Genre: Electronic Book
ISBN: 9788587922458

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Apresenta tendências, novas idéias e descobertas recentes no campo da Transferência Computacional de Calor e Massa

Analytical Heat and Fluid Flow in Microchannels and Microsystems

Analytical Heat and Fluid Flow in Microchannels and Microsystems
Author: Renato M. Cotta,Diego C. Knupp,Carolina P. Naveira-Cotta
Publsiher: Springer
Total Pages: 164
Release: 2015-10-10
Genre: Science
ISBN: 9783319233123

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This book focuses on the modeling and analysis of heat and fluid flow in microchannels and micro-systems, compiling a number of analytical and hybrid numerical-analytical solutions for models that account for the relevant micro-scale effects, with the corresponding experimental analysis validation when applicable. The volume stands as the only available compilation of easy to use analytically-based solutions for micro-scale heat and fluid flow problems, that systematically incorporates the most relevant micro-scale effects into the mathematical models, followed by their physical interpretation on the micro-system behavior.

Proceedings of the 8th Biennial Conference on Engineering Systems Design and Analysis 2006 Fatigue and fracture Heat transfer Internal combustion engines Manufacturing Technology and society

Proceedings of the 8th Biennial Conference on Engineering Systems Design and Analysis  2006  Fatigue and fracture  Heat transfer  Internal combustion engines  Manufacturing  Technology and society
Author: Anonim
Publsiher: Unknown
Total Pages: 135
Release: 2006
Genre: Engineering design
ISBN: UOM:39015069192220

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Thermal and Electro thermal System Simulation 2020

Thermal and Electro thermal System Simulation 2020
Author: Márta Rencz,Lorenzo Codecasa,Andras Poppe
Publsiher: MDPI
Total Pages: 310
Release: 2021-01-12
Genre: Technology & Engineering
ISBN: 9783039438310

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This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.

Heat Transfer

Heat Transfer
Author: Younes Shabany
Publsiher: CRC Press
Total Pages: 523
Release: 2009-12-17
Genre: Science
ISBN: 9781439814680

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The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems. Heat Transfer: Thermal Management of Electronics details how engineers can use intelligent thermal design to prevent heat-related failures, increase the life expectancy of the system, and reduce emitted noise, energy consumption, cost, and time to market. Appropriate thermal management can also create a significant market differentiation, compared to similar systems. Since there are more design flexibilities in the earlier stages of product design, it would be productive to keep the thermal design in mind as early as the concept and feasibility phase. The author first provides the basic knowledge necessary to understand and solve simple electronic cooling problems. He then delves into more detail about heat transfer fundamentals to give the reader a deeper understanding of the physics of heat transfer. Next, he describes experimental and numerical techniques and tools that are used in a typical thermal design process. The book concludes with a chapter on some advanced cooling methods. With its comprehensive coverage of thermal design, this book can help all engineers to develop the necessary expertise in thermal management of electronics and move a step closer to being a multidisciplinary engineer.

Department of Defense Dictionary of Military and Associated Terms

Department of Defense Dictionary of Military and Associated Terms
Author: United States. Joint Chiefs of Staff
Publsiher: Unknown
Total Pages: 135
Release: 1987
Genre: Military art and science
ISBN: UIUC:30112105150962

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Numerical Heat Transfer and Fluid Flow

Numerical Heat Transfer and Fluid Flow
Author: Suhas Patankar
Publsiher: CRC Press
Total Pages: 214
Release: 2018-10-08
Genre: Science
ISBN: 9781351991513

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This book focuses on heat and mass transfer, fluid flow, chemical reaction, and other related processes that occur in engineering equipment, the natural environment, and living organisms. Using simple algebra and elementary calculus, the author develops numerical methods for predicting these processes mainly based on physical considerations. Through this approach, readers will develop a deeper understanding of the underlying physical aspects of heat transfer and fluid flow as well as improve their ability to analyze and interpret computed results.

Fundamentals of Semiconductor Manufacturing and Process Control

Fundamentals of Semiconductor Manufacturing and Process Control
Author: Gary S. May,Costas J. Spanos
Publsiher: John Wiley & Sons
Total Pages: 428
Release: 2006-05-26
Genre: Technology & Engineering
ISBN: 9780471790273

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A practical guide to semiconductor manufacturing from processcontrol to yield modeling and experimental design Fundamentals of Semiconductor Manufacturing and Process Controlcovers all issues involved in manufacturing microelectronic devicesand circuits, including fabrication sequences, process control,experimental design, process modeling, yield modeling, and CIM/CAMsystems. Readers are introduced to both the theory and practice ofall basic manufacturing concepts. Following an overview of manufacturing and technology, the textexplores process monitoring methods, including those that focus onproduct wafers and those that focus on the equipment used toproduce wafers. Next, the text sets forth some fundamentals ofstatistics and yield modeling, which set the foundation for adetailed discussion of how statistical process control is used toanalyze quality and improve yields. The discussion of statistical experimental design offers readers apowerful approach for systematically varying controllable processconditions and determining their impact on output parameters thatmeasure quality. The authors introduce process modeling concepts,including several advanced process control topics such asrun-by-run, supervisory control, and process and equipmentdiagnosis. Critical coverage includes the following: * Combines process control and semiconductor manufacturing * Unique treatment of system and software technology and managementof overall manufacturing systems * Chapters include case studies, sample problems, and suggestedexercises * Instructor support includes electronic copies of the figures andan instructor's manual Graduate-level students and industrial practitioners will benefitfrom the detailed exami?nation of how electronic materials andsupplies are converted into finished integrated circuits andelectronic products in a high-volume manufacturingenvironment. An Instructor's Manual presenting detailed solutions to all theproblems in the book is available from the Wiley editorialdepartment. An Instructor Support FTP site is also available.

Handbook of Automotive Power Electronics and Motor Drives

Handbook of Automotive Power Electronics and Motor Drives
Author: Ali Emadi
Publsiher: CRC Press
Total Pages: 736
Release: 2017-12-19
Genre: Technology & Engineering
ISBN: 9781351836791

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Initially, the only electric loads encountered in an automobile were for lighting and the starter motor. Today, demands on performance, safety, emissions, comfort, convenience, entertainment, and communications have seen the working-in of seemingly innumerable advanced electronic devices. Consequently, vehicle electric systems require larger capacities and more complex configurations to deal with these demands. Covering applications in conventional, hybrid-electric, and electric vehicles, the Handbook of Automotive Power Electronics and Motor Drives provides a comprehensive reference for automotive electrical systems. This authoritative handbook features contributions from an outstanding international panel of experts from industry and academia, highlighting existing and emerging technologies. Divided into five parts, the Handbook of Automotive Power Electronics and Motor Drives offers an overview of automotive power systems, discusses semiconductor devices, sensors, and other components, explains different power electronic converters, examines electric machines and associated drives, and details various advanced electrical loads as well as battery technology for automobile applications. As we seek to answer the call for safer, more efficient, and lower-emission vehicles from regulators and consumer insistence on better performance, comfort, and entertainment, the technologies outlined in this book are vital for engineering advanced vehicles that will satisfy these criteria.

Moisture Sensitivity of Plastic Packages of IC Devices

Moisture Sensitivity of Plastic Packages of IC Devices
Author: X.J. Fan,E. Suhir
Publsiher: Springer Science & Business Media
Total Pages: 558
Release: 2010-07-23
Genre: Technology & Engineering
ISBN: 9781441957191

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Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.

Materials for Advanced Packaging

Materials for Advanced Packaging
Author: Daniel Lu,C.P. Wong
Publsiher: Springer
Total Pages: 969
Release: 2016-11-18
Genre: Technology & Engineering
ISBN: 9783319450988

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Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Dorland s Dictionary of Medical Acronyms and Abbreviations E Book

Dorland s Dictionary of Medical Acronyms and Abbreviations E Book
Author: Dorland
Publsiher: Elsevier Health Sciences
Total Pages: 488
Release: 2015-07-24
Genre: Medical
ISBN: 9780323442541

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Medical acronyms and abbreviations offer convenience, but those countless shortcuts can often be confusing. Now a part of the popular Dorland’s suite of products, this reference features thousands of terms from across various medical specialties. Its alphabetical arrangement makes for quick reference, and expanded coverage of symbols ensures they are easier to find. Effective communication plays an important role in all medical settings, so turn to this trusted volume for nearly any medical abbreviation you might encounter. Symbols section makes it easier to locate unusual or seldom-used symbols. Convenient alphabetical format allows you to find the entry you need more intuitively. More than 90,000 entries and definitions. Many new and updated entries including terminology in expanding specialties, such as Nursing; Physical, Occupational, and Speech Therapies; Transcription and Coding; Computer and Technical Fields. New section on abbreviations to avoid, including Joint Commission abbreviations that are not to be used. Incorporates updates suggested by the Institute for Safe Medication Practices (ISMP).

Assembly and Reliability of Lead Free Solder Joints

Assembly and Reliability of Lead Free Solder Joints
Author: John H. Lau,Ning-Cheng Lee
Publsiher: Springer Nature
Total Pages: 527
Release: 2020-05-29
Genre: Technology & Engineering
ISBN: 9789811539206

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This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.

Fundamentals of Lead Free Solder Interconnect Technology

Fundamentals of Lead Free Solder Interconnect Technology
Author: Tae-Kyu Lee,Thomas R. Bieler,Choong-Un Kim,Hongtao Ma
Publsiher: Springer
Total Pages: 253
Release: 2014-11-05
Genre: Technology & Engineering
ISBN: 9781461492665

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This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.