Microjoining and Nanojoining

Microjoining and Nanojoining
Author: Y N Zhou
Publsiher: Elsevier
Total Pages: 832
Release: 2008-03-27
Genre: Technology & Engineering
ISBN: 9781845694043

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Many important advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufacturing many electronic, precision and medical products. Part one reviews the basics of microjoining, including solid-state bonding and fusion microwelding. Part two covers microjoining and nanojoining processes, such as bonding mechanisms and metallurgy, process development and optimization, thermal stresses and distortion, positioning and fixturing, sensing, and numerical modelling. Part three discusses microjoining of materials such as plastics, ceramics, metals and advanced materials such as shape memory alloys and nanomaterials. The book also discusses applications of microjoining such as joining superconductors, the manufacture of medical devices and the sealing of solid oxide fuel cells. This book provides a comprehensive overview of the fundamental aspects of microjoining processes and techniques. It is a valuable reference for production engineers, designers and researchers using or studying microjoining technologies in such industries as microelectronics and biomedical engineering. Reviews the basics of nanojoining including solid-state bonding and fusion microwelding Covers microjoining and nanojoining processes such as bonding mechanisms and metallurgy, sensing and numerical modelling Examines applications of microjoining such as the manufacturing of medical devices, and the sealing of solid oxide fuel cells

Solid State Hydrogen Storage

Solid State Hydrogen Storage
Author: Gavin Walker
Publsiher: Elsevier
Total Pages: 600
Release: 2008-09-30
Genre: Technology & Engineering
ISBN: 9781845694944

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Hydrogen fuel cells are emerging as a major alternative energy source in transportation and other applications. Central to the development of the hydrogen economy is safe, efficient and viable storage of hydrogen. Solid-state hydrogen storage: Materials and chemistry reviews the latest developments in solid-state hydrogen storage. Part one discusses hydrogen storage technologies, hydrogen futures, hydrogen containment materials and solid-state hydrogen storage system design. Part two reviews the analysis of hydrogen interactions including structural characterisation of hydride materials, neutron scattering techniques, reliably measuring hydrogen uptake in storage materials and modelling of carbon-based materials for hydrogen storage. Part three analyses physically-bound hydrogen storage with chapters on zeolites, carbon nanostructures and metal-organic framework materials. Part four examines chemically-bound hydrogen storage including intermetallics, magnesium hydride, alanates, borohydrides, imides and amides, multicomponent hydrogen storage systems, organic liquid carriers, indirect hydrogen storage in metal ammines and technological challenges in hydrogen storage. With its distinguished editor and international team of contributors, Solid-state hydrogen storage: Materials and chemistry is a standard reference for researchers and professionals in the field of renewable energy, hydrogen fuel cells and hydrogen storage. Assesses hydrogen fuel cells as a major alternative energy source Discusses hydrogen storage technologies and solid-state hydrogen storage system design Explores the analysis of hydrogen interactions including reliably measuring hydrogen uptake in storage materials

Advanced Piezoelectric Materials

Advanced Piezoelectric Materials
Author: Kenji Uchino
Publsiher: Elsevier
Total Pages: 696
Release: 2010-09-27
Genre: Technology & Engineering
ISBN: 9781845699758

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Piezoelectric materials produce electric charges on their surfaces as a consequence of applying mechanical stress. They are used in the fabrication of a growing range of devices such as transducers (used, for example, in ultrasound scanning), actuators (deployed in such areas as vibration suppression in optical and microelectronic engineering), pressure sensor devices (such as gyroscopes) and increasingly as a way of producing energy. Their versatility has led to a wealth of research to broaden the range of piezoelectric materials and their potential uses. Advanced piezoelectric materials: science and technology provides a comprehensive review of these new materials, their properties, methods of manufacture and applications. After an introductory overview of the development of piezoelectric materials, Part one reviews the various types of piezoelectric material, ranging from lead zirconate titanate (PZT) piezo-ceramics, relaxor ferroelectric ceramics, lead-free piezo-ceramics, quartz-based piezoelectric materials, the use of lithium niobate and lithium in piezoelectrics, single crystal piezoelectric materials, electroactive polymers (EAP) and piezoelectric composite materials. Part two discusses how to design and fabricate piezo-materials with chapters on piezo-ceramics, single crystal preparation techniques, thin film technologies, aerosol techniques and manufacturing technologies for piezoelectric transducers. The final part of the book looks at applications such as high-power piezoelectric materials and actuators as well as the performance of piezoelectric materials under stress. With its distinguished editor and international team of expert contributors Advanced piezoelectric materials: science and technology is a standard reference for all those researching piezoelectric materials and using them to develop new devices in such areas as microelectronics, optical, sound, structural and biomedical engineering. Provides a comprehensive review of the new materials, their properties and methods of manufacture and application Explores the development of piezoelectric materials from the historical background to the present status Features an overview of manufacturing methods for piezoelectric ceramic materials including design considerations

Joining Processes for Dissimilar and Advanced Materials

Joining Processes for Dissimilar and Advanced Materials
Author: Pawan Kumar Rakesh,J. Paulo Davim
Publsiher: Woodhead Publishing
Total Pages: 692
Release: 2021-11-13
Genre: Technology & Engineering
ISBN: 9780323860208

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Joining Processes for Dissimilar and Advanced Materials describes how to overcome the many challenges involved in the joining of similar and dissimilar materials resulting from factors including different thermal coefficients and melting points. Traditional joining processes are ineffective with many newly developed materials. The ever-increasing industrial demands for production efficiency and high-performance materials are also pushing this technology forward. The resulting emergence of advanced micro- and nanoscale material joining technologies, have provided many solutions to these challenges. Drawing on the latest research, this book describes primary and secondary processes for the joining of advanced materials such as metals and alloys, intermetallics, ceramics, glasses, polymers, superalloys, electronic materials and composites in similar and dissimilar combinations. It also covers details of joint design, quality assurance, economics and service life of the product. Provides valuable information on innovative joining technologies including induction heating of metals, ultrasonic heating, and laser heating at micro- and nanoscale levels Describes the newly developed modelling, simulation and digitalization of the joining process Includes a methodology for characterization of joints

Advanced Adhesives in Electronics

Advanced Adhesives in Electronics
Author: M O Alam,C Bailey
Publsiher: Elsevier
Total Pages: 280
Release: 2011-05-25
Genre: Technology & Engineering
ISBN: 9780857092892

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Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques

Nano Bio Electronic Photonic and MEMS Packaging

Nano Bio  Electronic  Photonic and MEMS Packaging
Author: C.P. Wong,Kyoung-Sik Moon,Yi (Grace) Li
Publsiher: Springer Science & Business Media
Total Pages: 761
Release: 2009-12-23
Genre: Technology & Engineering
ISBN: 1441900403

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Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. “Nano and Bio Electronics Packaging” discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.

Nano Bio Electronic Photonic and MEMS Packaging

Nano Bio  Electronic  Photonic and MEMS Packaging
Author: C. P.(Ching-Ping) Wong,Kyoung-sik (Jack) Moon,Yi Li
Publsiher: Springer Nature
Total Pages: 582
Release: 2021-03-17
Genre: Technology & Engineering
ISBN: 9783030499914

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This book shows how nanofabrication techniques and nanomaterials can be used to customize packaging for nano devices with applications to electronics, photonics, biological and biomedical research and products. It covers topics such as bio sensing electronics, bio device packaging, MEMS for bio devices and much more, including: Offers a comprehensive overview of nano and bio packaging and their materials based on their chemical and physical sciences and mechanical, electrical and material engineering perspectives; Discusses nano materials as power energy sources, computational analyses of nano materials including molecular dynamic (MD) simulations and DFT calculations; Analyzes nanotubes, superhydrophobic self-clean Lotus surfaces; Covers nano chemistry for bio sensor/bio material device packaging. This second edition includes new chapters on soft materials-enabled packaging for stretchable and wearable electronics, state of the art miniaturization for active implantable medical devices, recent LED packaging and progress, nanomaterials for recent energy storage devices such as lithium ion batteries and supercapacitors and their packaging. Nano- Bio- Electronic, Photonic and MEMS Packaging is the ideal book for all biomedical engineers, industrial electronics packaging engineers, and those engaged in bio nanotechnology applications research.

Encyclopedia Of Packaging Materials Processes And Mechanics Set 1 Die attach And Wafer Bonding Technology A 4 volume Set

Encyclopedia Of Packaging Materials  Processes  And Mechanics   Set 1  Die attach And Wafer Bonding Technology  A 4 volume Set
Author: Anonim
Publsiher: World Scientific
Total Pages: 1080
Release: 2019-08-27
Genre: Technology & Engineering
ISBN: 9789811209642

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Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories.The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging 'learning curve,' the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications.

Handbook of Laser Welding Technologies

Handbook of Laser Welding Technologies
Author: S Katayama
Publsiher: Elsevier
Total Pages: 654
Release: 2013-06-30
Genre: Technology & Engineering
ISBN: 9780857098771

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Laser welding is a rapidly developing and versatile technology which has found increasing applications in industry and manufacturing. It allows the precision welding of small and hard-to-reach areas, and is particularly suitable for operation under computer or robotic control. The Handbook of laser welding technologies reviews the latest developments in the field and how they can be used across a variety of applications. Part one provides an introduction to the fundamentals of laser welding before moving on to explore developments in established technologies including CO2 laser welding, disk laser welding and laser micro welding technology. Part two highlights laser welding technologies for various materials including aluminium and titanium alloys, plastics and glass. Part three focuses on developments in emerging laser welding technologies with chapters on the applications of robotics in laser welding and developments in the modelling and simulation of laser and hybrid laser welding. Finally, part four explores the applications of laser welding in the automotive, railway and shipbuilding industries. The Handbook of laser welding technologies is a technical resource for researchers and engineers using laser welding technologies, professionals requiring an understanding of laser welding techniques and academics interested in the field. Provides an introduction to the fundamentals of laser welding including characteristics, welding defects and evolution of laser welding Discusses developments in a number of techniques including disk, conduction and laser micro welding Focusses on technologies for particular materials such as light metal alloys, plastics and glass

Joining and Assembly of Medical Materials and Devices

Joining and Assembly of Medical Materials and Devices
Author: Y N Zhou,M D Breyen
Publsiher: Elsevier
Total Pages: 574
Release: 2013-05-31
Genre: Technology & Engineering
ISBN: 9780857096425

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As medical devices become more intricate, with an increasing number of components made from a wide range of materials, it is important that they meet stringent requirements to ensure that they are safe to be implanted and will not be rejected by the human body. Joining and assembly of medical materials and devices provides a comprehensive overview of joining techniques for a range of medical materials and applications. Part one provides an introduction to medical devices and joining methods with further specific chapters on microwelding methods in medical components and the effects of sterilization on medical materials and welded devices. Part two focuses on medical metals and includes chapters on the joining of shape memory alloys, platinum (Pt) alloys and stainless steel wires for implantable medical devices and evaluating the corrosion performance of metal medical device welds. Part three moves on to highlight the joining and assembly of medical plastics and discusses techniques including ultrasonic welding, transmission laser welding and radio frequency (RF)/dielectric welding. Finally, part four discusses the joining and assembly of biomaterial and tissue implants including metal-ceramic joining techniques for orthopaedic applications and tissue adhesives and sealants for surgical applications. Joining and assembly of medical materials and devices is a technical guide for engineers and researchers within the medical industry, professionals requiring an understanding of joining and assembly techniques in a medical setting, and academics interested in this field. Introduces joining methods in medical applications including microwelding and considers the effects of sterilization on the resulting joints and devices Considers the joining, assembly and corrosion performance of medical metals including shape memory alloys, platinum alloys and stainless steel wires Considers the joining and assembly of medical plastics including multiple welding methods, bonding strategies and adhesives

Engineering Steels and High Entropy Alloys

Engineering Steels and High Entropy Alloys
Author: Ashutosh Sharma,Sanjeev Kumar,Zoia Duriagina
Publsiher: BoD – Books on Demand
Total Pages: 286
Release: 2020-06-24
Genre: Technology & Engineering
ISBN: 9781789859478

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"This book entitled “Engineering Steels and High Entropy-Alloys” presents an overview of various types of advanced steels and high entropy alloys. It also discusses the current research trends, problems, and applications of engineering steels and high entropy materials. The book also gives a brief overview of advances in surface protection strategies of steels and laser processing of materials (additive manufacturing). The various key features of this book include: 1. A comprehensive overview of various types of engineering steels, phase transformation, and applications in engineering. 2. A complete detailed understanding and mechanism of high entropy materials, including high entropy alloys and ceramics. 3. Descriptions of structure-property relationships in high entropy materials and their application in various fields such as biomedical implants. 4. A brief review of various laser processing (additive manufacturing) and surface protection of advanced materials."

Fracture Fatigue Failure and Damage Evolution Volume 7

Fracture  Fatigue  Failure and Damage Evolution  Volume 7
Author: Jay Carroll,Shuman Xia,Alison M. Beese,Ryan B. Berke,Garrett J Pataky
Publsiher: Springer
Total Pages: 127
Release: 2017-08-24
Genre: Science
ISBN: 9783319628318

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Fracture, Fatigue, Failure and Damage Evolution, Volume 7 of the Proceedings of the 2017 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the seventh volume of nine from the Conference, brings together contributions to this important area of research and engineering. Session organizers include: Jay Carroll, Shuman Xia, Allison Beese, Ryan Berke, Garrett Pataky, Samantha Daly, Kavan Hazeli, Antonios Kontsos, Omer Ozgur Capraz, Scott Grutzik, Onome Scott-Emaukpor The collection presents early findings and case studies on a wide range of areas, including: Mechanics of Energy & Energetic Materials Vibration Effects in Fracture & Fatigue Fracture & Fatigue of Additively Manufactured Materials In Situ Techniques for Fatigue & Fracture Microscale & Microstructural Effects on Mechanical Behavior Fracture & Fatigue of Composites Integration & Validation of Models with Experiments Fracture & Fatigue in Extreme Environments Novel Experimental Methods for Fatigue and Fracture Fracture of Brittle & Ductile Materials Interfacial Fracture

Implantable Sensor Systems for Medical Applications

Implantable Sensor Systems for Medical Applications
Author: Andreas Inmann,Diana Hodgins
Publsiher: Elsevier
Total Pages: 544
Release: 2013-01-02
Genre: Science
ISBN: 9780857096289

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Implantable sensor systems offer great potential for enhanced medical care and improved quality of life, consequently leading to major investment in this exciting field. Implantable sensor systems for medical applications provides a wide-ranging overview of the core technologies, key challenges and main issues related to the development and use of these devices in a diverse range of medical applications. Part one reviews the fundamentals of implantable systems, including materials and material-tissue interfaces, packaging and coatings, microassembly, electrode array design and fabrication, and the use of biofuel cells as sustainable power sources. Part two goes on to consider the challenges associated with implantable systems. Biocompatibility, sterilization considerations and the development of active implantable medical devices in a regulated environment are discussed, along with issues regarding data protection and patient privacy in medical sensor networks. Applications of implantable systems are then discussed in part three, beginning with Microelectromechanical systems (MEMS) for in-vivo applications before further exploration of tripolar interfaces for neural recording, sensors for motor neuroprostheses, implantable wireless body area networks and retina implants. With its distinguished editors and international team of expert contributors, Implantable sensor systems for medical applications is a comprehensive guide for all those involved in the design, development and application of these life-changing technologies. Provides a wide-ranging overview of the core technologies, key challenges and main issues related to the development and use of implantable sensor systems in a range of medical applications Reviews the fundamentals of implantable systems, including materials and material-tissue interfaces, packaging and coatings, and microassembly Considers the challenges associated with implantable systems, including biocompatibility and sterilization

Micro and Precision Manufacturing

Micro and Precision Manufacturing
Author: Kapil Gupta
Publsiher: Springer
Total Pages: 195
Release: 2017-10-15
Genre: Technology & Engineering
ISBN: 9783319688015

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This book provides details on various micro and precision manufacturing and finishing operations performed by conventional and advanced processes, including micro-manufacturing of micro-tools and precision finishing of engineered components. It describes the process mechanism, principles and parameters while performing micro-fabrication and precision finishing operations. The text provides the readers with knowledge of micro and precision manufacturing and encourages them to explore the future venues in this field.

Ecological Design of Smart Home Networks

Ecological Design of Smart Home Networks
Author: N. Saito,D Menga
Publsiher: Elsevier
Total Pages: 130
Release: 2015-03-31
Genre: Technology & Engineering
ISBN: 9781782421245

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This book provides an authoritative guide for postgraduate students and academic researchers in electronics, computer and network engineering, telecommunications, energy technology and home automation, as well as R&D managers in industrial sectors such as wireless technology, consumer electronics, telecommunications and networking, information technology, energy technology and home automation. Part One outlines the key principles and technologies needed for ecological smart home networks. Beginning with a thorough overview of the concept behind ecological smart home network design, the book reviews such important areas as power line communications, hybrid systems and middleware platforms. Part Two then goes on to discuss some important applications of this technology, with wireless smart sensor networks for home and telecare, and smart home networking for content and energy management (including the intelligent Zero Emission Urban System), all explored in detail. More systematic and comprehensive coverage: the book covers ecological design and technology requirements, performance and applications for smart home networks Better focus on industry needs: the book covers current and emerging smart home networking technologies. It explains how the technologies work, how they have developed, their capabilities and the markets that they target Better coverage of the best international research: the book is multi-contributor and brings together the leading researchers from around the world